Technology offer

The IMB-CNM Integrated Clean Room includes equipment for micro and nanofabrication processes mainly based on silicon technologies for wafers of 100mm and 150mm, but can also operate with substrates of different materials and sizes on demand. Its structure allows flexible operation, which makes it especially suitable for R+D+i.

Thermal Processes and CVD

The following thermal and Chemical Vapour Deposition based processes are available:

Oxidation, annealing and diffusion processes on tubular furnaces.
Deposition of silicon oxides and nitrides, polycrystalline silicon and BPSG on LPCVD and PECVD systems.
Deposition of high-k dielectrics on a thermal ALD system.
High temperature RTP processes for SiC technology.

Techniques and equipment

Ion Implantation

Two medium current ion implantation systems are available for implanting a number of species: B, P, As, N, Ar, Al, Si, Mg, O, He.

Techniques and equipment

Dry Etching

A number of dry etching (plasma-based) systems and processes are available:

Reactive Ion Etching (RIE) systems for aluminum, polysilicon, silicon oxide and silicon nitride materials.
Deep reactive Ion Etching (DRIE) systems for deep silicon and silicon dioxide etching.
Photoresist ashing.

Techniques and equipment

Inspection and measurement

Optical Microscopy
Thin film thickness measurement by Spectral Reflectance
Spectral Ellipsometry
3D optical Profilometry
Mechanical Profilometry
FT-IR Spectroscopy
Sheet Resistance measurement
Bow and Thickness measurement
Life Time measurement

Techniques and equipment

Metallization

Metal thin films of a variety of materials can be deposited by Physical Vapor Deposition techniques on either DC and DC/RF sputtering systems, or on thermal and e-beam evaporation systems.

Techniques and equipment

Microsystems Processes

Various microsystems-specific processes are available:

Silicon anisotropic wet etching with alkaline solutions.
Surface micromachining (sacrificial layer etching).
Critical point drying for releasing micromachined structures.
Lift-off etching processes.

Techniques and equipment

Nanolithography

The following processes are available for achieving sub-100 nm resolution:

Electron beam lithography (EBL)
AFM based nanofabrication
Nanoimprint lithography
Focused Ion Beam (FIB)
Scanning Electron Microscopy (SEM)

Techniques and equipment

Wet Etching and Cleaning Processes

Wet etching processes consisting on isotropic chemical attacks in aqueos solution of a variety of materials.
Microelectronic fabrication cleaning processes and photoresist removal

Techniques and equipment